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PCBA貼片在焊接之前的哪些因素會有影響?

Release Time:2021-11-10 Edit the author:金致卓 Reading:1450

PCBA貼片的生產進行加工中在回流焊階段可以采用不同溫度變化曲線的預熱對于焊接工作質量的提升是有顯著影響效果的。下面給大家一個簡單介紹一下回流焊前的預熱都有什么效果。

再流焊溫度曲線的設置直接影響到PCBA貼片的質量?;亓骱盖熬徛訜岷皖A熱有助于活化助焊劑,防止熱震,提高焊點質量。

回流焊的預熱階段起著將整個PCBA組件的溫度從室溫穩定升高到低于焊膏熔點(通常接近150攝氏度)的保持溫度,并調節溫度變化以保持每秒幾度的恒定斜率的作用。SMT加工的回流預熱階段完成后,就是均熱階段,會保持一段時間的溫度,保證板材受熱均勻。然后回流階段開始形成焊點。在預熱和浸泡階段,焊膏中的揮發性溶劑被燒掉,焊劑被激活。

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