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SMT加工維修技巧

Release Time:2022-03-07 Edit the author:金致卓 Reading:366


手工焊接應遵循先小后大、先低后高的原則,將分類批量焊接,先焊片式電阻、片式電容、晶體管,再焊小型IC器件、大型IC器件,最后焊插件。

焊接片式元件時,焊頭的寬度應與元件的寬度相同。如果太小,組裝焊接時不容易定位。當焊接像SOP、 QFP、 PLCC這樣兩面或四面都有引腳的器件時,需要在兩

面或四面焊接幾個定位點。仔細檢查并確認每個引腳與相應的焊盤匹配后,可以通過拖動來焊接其余的引腳。焊接不要拖得太快,1 s左右拖一個焊點即可。焊接后,用4~6倍的放大鏡檢查焊點之間有無橋接。在有橋的地方,用刷子蘸一點焊劑,然后再進行拖拉焊接。同一部位的焊接不得連續超過2次。如果不是一次焊完,要冷卻后再焊。在焊接IC器件時,在焊盤上均勻涂上一層錫膏,不僅可以滲透和幫助焊點,還可以大大方便維修工人的操作,提高維修速度。

成功修復的兩個關鍵過程是焊前預熱和焊后冷卻。

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